Relife soldering paste for BGA and SMD reballing

Relife soldering paste for BGA and SMD reballing

Relife
37C_solder_paste_relife
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The Relife brand soldering paste is a consumable material designed for precise service work, soldering SMD components and reballing BGA chips. It works well for repairs of motherboards in mobile and computer devices, where repeatability and control over the soldering process matter.

  • Application: BGA reballing, SMD soldering, motherboard repairs.
  • Consistency: suitable viscosity that makes application through BGA stencils easier.
  • Conductivity: supports creating durable connections with good electrical conductivity.
  • Work under a microscope: a formula that makes soldering components with a high density of leads easier.
  • Residue: minimal amount of residue after soldering is completed.
Hurry! only 10 items left in stock.

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10 zł21.60 zł24.00
zł24.00
Delivery in Poland 1-2 business days, in Europe 2-4 days.
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The Relife soldering paste is a professional consumable material developed for advanced electronics repairs, in particular smartphones, laptops and motherboards. Its density and consistency have been selected to make application through stencils easier during the BGA reballing process and to make soldering the smallest SMD components under a microscope easier.

Thanks to a specially developed formula, the paste efficiently joins fine integrated circuit leads, reducing the risk of cold solder joints. It is characterized by good wettability, and under the influence of the appropriate hot-air temperature it quickly and smoothly forms solder balls. The paste does not dry out quickly in the package, which translates into convenience of work and a longer useful life after opening.

Key features

  • High precision: it works well in microsoldering, motherboard repairs and work with chips with a high density of pins.
  • Excellent viscosity: it adheres well to BGA stencils and does not spread on its own before heating.
  • Reliable joints: it makes it easier to create smooth, shiny and durable solder connections with good electrical conductivity.
  • Clean work: it leaves a minimal amount of residue after the soldering process is completed.
  • Versatility: useful in services repairing mobile devices, consoles and computers.

Use in service

The paste is intended for reballing BGA chips and soldering SMD components. It works well for motherboard repairs, where control over the amount of applied material and repeatability of the process are required. It can be applied through BGA stencils, and also used for spot soldering of small components under a microscope.

How to work with soldering paste

  • Apply the paste evenly through a stencil or pointwise onto the soldering spot.
  • Heat the area with hot air to the temperature appropriate for the alloy used.
  • After the solder balls are formed, remove excess residue in accordance with safety rules.
  • Store the paste in a cool place to maintain its working properties.

Why choose this paste

Relife is a material that combines precision, good viscosity and cleanliness of work. This makes it easier to perform repairs requiring patience and accuracy, such as BGA reballing or soldering densely arranged SMD components. It is a product aimed at professional electronics and GSM services.

: 37C_solder_paste_relife
: 10 Items
Hurry! only 10 items left in stock.
New

Specific References

EAN13
5903981929184

Please note that shipments outside Poland are currently suspended due to EPR (Extended Producer Responsibility) regulations.

We are currently reviewing the available options and associated costs of expanding international shipping while ensuring compliance with applicable EPR requirements.

We apologize for any inconvenience and appreciate your understanding and patience.

We have three main product condition types in our shop:

1. New - brand new, mostly used for the first assembly, such as integraded chips, data sockets or analogue sticks. Covered by a 24-month warranty (6 months for batteries).

2. Used - the smallest group in our assortment. Fully functional, but we cannot determine their condition. Mostly items that do not breaks down. These group include power supplies for consoles (e.g. 3DS or Xbox 360) or memory cards. Covered by a 6-month warranty.

3. Refurbished renewed, from disassembly - the largest group of products - professionally disassembled, tested for proper operation and, if necessary, refurbished and cleaned. They meet the same quality requirements that the manufacturer sets for all new devices. Key components replaced using original parts (e.g. lasers in disc drives, analogue sticks in controllers). Covered by a 12-month warranty (6 months for batteries).

In cases where the visual aspect is important (e.g. housings), the assortment is divided into 3 additional subgroups:

  • Grade A - perfect condition, products are most often obtained from the dismantling of brand new devices.
  • Grade B - minimal traces of use resulting from a short time of use or repackaging. Warranty exchanges of equipment, 14-day returns, etc.
  • Grade C - goods in generally good condition, with normal traces of use resulting from use.

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Relife soldering paste for BGA and SMD reballing

The Relife brand soldering paste is a consumable material designed for precise service work, soldering SMD components and reballing BGA chips. It works well for repairs of motherboards in mobile and computer devices, where repeatability and control over the soldering process matter.

  • Application: BGA reballing, SMD soldering, motherboard repairs.
  • Consistency: suitable viscosity that makes application through BGA stencils easier.
  • Conductivity: supports creating durable connections with good electrical conductivity.
  • Work under a microscope: a formula that makes soldering components with a high density of leads easier.
  • Residue: minimal amount of residue after soldering is completed.

Write your review